同济大学主页平台管理系统夏菁菁--中文主页-- Investigating the partial plastic formation mechanism of typical scratches on silicon wafers induced by rogue particles during chemical mechanical polishing

夏菁菁

教师英文名称： Jingjing Xia
教师拼音名称： Xia Jingjing
学历：博士研究生毕业
学位：博士学位
毕业院校：同济大学

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Investigating the partial plastic formation mechanism of typical scratches on silicon wafers induced by rogue particles during chemical mechanical polishing

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发表刊物：Materials Science in Semiconductor Processing

关键字：Chemical mechanical polishing; Morphological characteristics; Partial plasticity; Scratching behavior; Silicon wafers

论文类型：期刊论文

通讯作者：夏菁菁

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