王昆
- 教授
- 教师拼音名称： wangkun
- 电子邮箱：
- 职务： 同济大学机械工程系党支部书记、现代制造技术研究所副所长
- 学历： 博士研究生毕业
- 学位： 博士学位
- 主要任职： 同济大学教授、博士生导师
- 其他任职： 国家科学技术奖励会评专家
- 毕业院校： 南京航空航天大学
- 学科：机械工程
机械
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- [1]Investigation on the electrochemical micromachining of micro holes with variable cross-section.International Conference on Machine Tool Technology and Mechatronics Engineering, ICMTTME 2014,2014,644-6504927-4931.
- [2]Investigation on Delamination Factor in Drilling Medium Density Fiberboards with Variable Feed Pressure using Multi-Spindle Drill.KREUZSTRASSE 10, 8635 DURNTEN-ZURICH, SWITZERLAND:4th International Conference on Manufacturing Science and Engineering (ICMSE 2013),2013,690-6932529-2534.
- [3]Corrosion behaviors and electrochemical mechanisms of laser-cladded NiCrAlMo/nano-CeO2 composite coatings in chloride-enriched environments.1 OLIVERS YARD, 55 CITY ROAD, LONDON EC1Y 1SP, ENGLAND:Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture,2022,236(11):1496-1507.
- [4]王昆,Thermal stress cleaving of glass-based X-ray telescope lenses by heated wire to eliminate microdefects.HACKERBRUCKE 6, 80335 MUNICH, GERMANY:OPTIK,2021,226
- [5]王昆,Hot-wire thermal stress cleaving process of glass with micro crack-free edges.530 WALNUT STREET, STE 850, PHILADELPHIA, PA 19106 USA:MATERIALS AND MANUFACTURING PROCESSES,2020,35(5):491-497.
- [6]王昆,Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography.18 WEST 27TH ST, NEW YORK, NY 10001 USA:SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY,2012,48(2):99-104.
- [7]王昆,Localized Electrochemical Deburring of Cross Hole Using Gelatinous Electrolyte.530 WALNUT STREET, STE 850, PHILADELPHIA, PA 19106 USA:MATERIALS AND MANUFACTURING PROCESSES,2016,31(13):1749-1754.
- [8]王昆,Electrochemical micromachining using vibratile tungsten wire for high-aspect-ratio microstructures.18 WEST 27TH ST, NEW YORK, NY 10001 USA:SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY,2010,46(5):395-399.
- [9]王昆,Influence of pneumatic pressure on delamination factor of drilling medium density fiberboard.LAMACSKA CESTA 3, BRATISLAVA, SK-841 04, SLOVAKIA:Wood Research,2015,60(3):429-440.
- [10]王昆,Influence of surface roughness on wet adhesion of biomimetic adhesive pads with planar microstructures.MICHAEL FARADAY HOUSE SIX HILLS WAY STEVENAGE, HERTFORD SG1 2AY, ENGLAND:MICRO & NANO LETTERS,2012,7(12):1274-1277.