王昆
- 教授
- 教师拼音名称： wangkun
- 电子邮箱：
- 职务： 同济大学机械工程系党支部书记、现代制造技术研究所副所长
- 学历： 博士研究生毕业
- 学位： 博士学位
- 主要任职： 同济大学教授、博士生导师
- 其他任职： 国家科学技术奖励会评专家
- 毕业院校： 南京航空航天大学
- 学科：机械工程
机械
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- [1]王昆.Investigation on the electrochemical micromachining of micro holes with variable cross-sectionInternational Conference on Machine Tool Technology and Mechatronics Engineering, ICMTTME 2014,2014,644-6504927-4931.
- [2]王昆.Investigation on delamination factor in drilling medium density fiberboards with variable feed pressure using multi-spindle drillKREUZSTRASSE 10, 8635 DURNTEN-ZURICH, SWITZERLAND:4th International Conference on Manufacturing Science and Engineering, ICMSE 2013,2013,690 6932529-2534.
- [3]王昆.Corrosion behaviors and electrochemical mechanisms of laser-cladded NiCrAlMo/nano-CeO2 composite coatings in chloride-enriched environmentsProceedings of the Institution of Mechanical Engineers,2022,(11):1496-1507.
- [4]王昆,Thermal stress cleaving of glass-based X-ray telescope lenses by heated wire to eliminate microdefectsOptik,2021,(P1):165996-.
- [5]王昆,Hot-wire thermal stress cleaving process of glass with micro crack-free edges530 WALNUT STREET, STE 850, PHILADELPHIA, PA 19106 USA:Materials and Manufacturing Processes,2020,35(5):491-497.
- [6]王昆,Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography18 WEST 27TH ST, NEW YORK, NY 10001 USA:Surface Engineering and Applied Electrochemistry,2012,48(2):99 - 104.
- [7]王昆,Localized Electrochemical Deburring of Cross Hole Using Gelatinous Electrolyte530 WALNUT STREET, STE 850, PHILADELPHIA, PA 19106 USA:MATERIALS AND MANUFACTURING PROCESSES,2016,31(13):1749-1754.
- [8]王昆,Electrochemical micromachining using vibratile tungsten wire for high-aspect-ratio microstructures18 WEST 27TH ST, NEW YORK, NY 10001 USA:Surface Engineering and Applied Electrochemistry,2010,46(5):395-399.
- [9]王昆,INFLUENCE OF PNEUMATIC PRESSURE ON DELAMINATION FACTOR OF DRILLING MEDIUM DENSITY FIBERBOARDLAMACSKA CESTA 3, BRATISLAVA, SK-841 04, SLOVAKIA:WOOD RESEARCH,2015,60(3):429-439.
- [10]王昆,Influence of surface roughness on wet adhesion of biomimetic adhesive pads with planar microstructuresMICHAEL FARADAY HOUSE SIX HILLS WAY STEVENAGE, HERTFORD SG1 2AY, ENGLAND:Micro and Nano Letters,2012,7(12):1274-1277.