一种可直接嵌入芯片内部的变径特斯拉阀相变冷却微通道
Affilication of Author(s):机械与能源工程学院
Disigner of the Invention:袁志成,王天宇,李凯奇,胡明玥,朱焕林,刘洋
Type of Patent:发明
State of Patent:实审请求
Application Number:202411858738.1
Service Invention or Not:no
Application Date:2024-12-17
- Next One:一种具备多层级微纳结构的疏水表面