Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon
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Impact Factor:3.748
Affiliation of Author(s):物理科学与工程学院
Journal:MATERIALS
Place of Publication:ST ALBAN-ANLAGE 66, CH-4052 BASEL, SWITZERLAND
Key Words:chemical; chemical–mechanical polishing; mechanical polishing; monocrystalline silicon; power spectral density; removal mechanism; roughness
First Author:Jingjing Xia
Indexed by:Article
Volume:15
Issue:16
Translation or Not:no
Date of Publication:2022-01-01
Included Journals:PUBMED、CNKI、EI、SCOPUS、WOS