Functional layer designation of combined chip seal and slurry seal in airport pavement
Journal:29th International Congress on Sound and Vibration (ICSV)
Note:Prague, Czech. Silesian University Press, 2023.
Co-author:Xiaoluo Yu,Qingbo He,Yang Yang,Zhike Peng
First Author:Peng Zhou
Document Type:C
Page Number:Prague,Czech.Silesian University Press,2023
Translation or Not:no



