Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography
Impact Factor:0.332
Affiliation of Author(s):机械与能源工程学院
Journal:SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY
Place of Publication:18 WEST 27TH ST, NEW YORK, NY 10001 USA
First Author:wangkun
Indexed by:Periodical papers
Volume:48
Issue:2
Page Number:99-104
ISSN No.:1068-3755
Translation or Not:no
Date of Publication:2012-01-01
Included Journals:EI、INSPEC、SCOPUS、WANFANG、CNKI、WOS